July 27, 2018 – Skyhaven Systems was awarded a contract from NASA to develop a new class of thermal interface materials. Continued development of electronic systems demands new thermal management technology to dissipate high thermal heat loads that can have deleterious effects on electronics’ performance and reliability. In particular, as electronic devices continue to shrink in size, heat loads proportionally increase along with the potential for cross-talk. Accordingly, NASA electronics designers need new thermal interface materials that are thermally conductivity, yet electrically insulative that can function as adhesives, pastes, underfills, and coatings for cooling electronic components and systems. Aluminum nitride based thermal interface materials are being produced that have thermal conductivities greater than 10 W/m-K while being electrically non-conductive. Applications for thermal interface materials in electronics are extensive where continued developments in electronics’ technology requires advanced thermal management technology to dissipate high heat fluxes. The global market for thermal management products is expected to grow to $14.7 billion in 2019, a compound annual growth rate of 6.8% over the 2014 – 2019 period where thermal interface materials are expected to garner 10% of this market. Accordingly, the 2019 market for thermal technology materials is $1.5 billion on the broad scale.