April 9, 2018 – The Department of Energy awarded a contract to Skyhaven Systems to continue developing compact thermal management devices for cooling electronics. Low cost and light weight cooling systems are needed for on-detector nuclear electronics with a minimal material budget that minimizes radiation adsorption and a minimal temperature difference between the heat source and heat sink. Toward this need, Skyhaven is developing a two-phase thermal management device to cool electronics that have high thermal loads approaching 1000 W/cm2. This cooling product is based on loop heat pipe technology that operates passively. Of particular importance with this product is a new evaporator design that takes in heat from the item being cooled via evaporating the coolant. To maintain lightweight and highly efficient systems, it is imperative that these evaporators be optimized for their thermal performance. Furthermore, current evaporators using capillary based heat transfer devices are difficult to assemble due to the porous wick requirements that force devices to be produced via thermal sintering or 3D metal laser printing adding cost and mass to the device. To this end, a new evaporator design and a new manufacturing method are being used by Skyhaven Systems to produce very lightweight and low-cost evaporator units for loop heat pipe systems that will be incorporated into RF power amplifiers used in on-detector nuclear electronic systems as well as other electronic systems.