February 18, 2020 – The Department of Energy awarded a contract to Skyhaven Systems to develop a thermal management cooling system using loop heat pipe technology for cooling nuclear electronic components. Electronic components and applications such as GaN power amplifiers, diode lasers, medical devices, inverter modules for hybrid electric vehicles, and military applications including weapons, phased array radar, and sensors emit high amounts of waste heat pushing the limits of thermal cooling toward heat fluxes ranging from 100 to 1000 W/cm2. These heat load requirements cannot be met with traditional single-phase cooling approaches requiring new two-phase cooling schemes. What the market needs is an effective two-phase thermal management cooling device that can be manufactured at low costs and made available to a wider market, not through niche custom made-to-order applications. The innovation being offered to the marketplace is a two-phase thermal management device based on loop heat pipe technology. In prior endeavors, Skyhaven has produced thermal management components that can be used for loop heat pipe cooling that include a planar evaporator and a micro-channel array for use as a condenser. These component prototypes are lightweight and inexpensive to manufacture using additive-based technology developed in previous DOE programs for electronics cooling. These components are being adapted and modified into an operational 1000 W/cm2 capable loop heat pipe system that costs $100, a low value that will enable wider adoption of this advanced cooling product in the broader electronics marketplace.